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Revision History For: ChipPAC (CHPC)

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The company packages semiconductors in protective cases that attach to printed circuit boards. It focuses on ball grid array packaging (68% of sales), but also provides leaded packaging services. ChipPAC also tests semiconductors and has expanded its functionality and reliability testing services by acquiring Intersil's Malaysian packaging and testing operations. ChipPAC has more than 75 customers, with Intel accounting for nearly half of sales. Entities affiliated with Bain Capital and Citicorp Venture Capital own 31% and 30% of ChipPAC, respectively. Customers Hyundai Electronics and Intel also own stakes in the company.