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Politics : Formerly About Applied Materials

AMAT 318.63

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To: Henry Eichorszt who wrote (23365)	8/26/1998 6:22:00 PM
From: Proud_Infidel	Read Replies (1) of 70976

TI Plans to Pull In .10 micron Production to 2001: pubs.cmpnet.com Excerpt:While TI researchers said the aggressive schedule was not an acceleration of next-generation technology, the planned use of 0.10-micron CMOS (drawn-gate length) processes is a couple of years ahead of the national roadmap, published by the Semiconductor Industry Association (SIA). Most leading chip manufacturers are just now beginning to move IC designs to new 0.18-micron technologies with 0.15- and 0.13-micron expected to follow in the next several years. Intel Corp., for example, plans to bring its 0.13-micron process technology into production around 2002--a time frame when it also believes 300-mm wafer fabrication will be feasible. Intel has not yet officially set a schedule for the launch of 0.10-micron technology, according to a company spokesman. Will we now see similar pull ins by the likes of INTC or IBM? Time will tell. However, I do not think that the .10mu process can be attained by die shrinks, a common Bear theme. BK

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