Some news for ACLS :
Global Electronics Company Selects Axcelis Technologies, Inc. for 300mm Dry
Strip Applications; Multiple FusionES3 Systems to be Installed this Month
Business/Technology Editors
BEVERLY, Mass.--(BUSINESS WIRE)--Aug. 30, 2000--Axcelis
Technologies, Inc.(Nasdaq: ACLS), formerly Eaton Semiconductor
Equipment Operations, today announced that a major electronics
manufacturer has purchased five FusionES3 tools for dry photoresist
removal in the production of logic devices on 300mm wafers.
Installation of the FusionES3 300mm systems is scheduled this month at
the customer's state-of-the-art 300mm fab. This is the 4th major chip
manufacturer to purchase Axcelis' FusionES3 this year.
Axcelis' photoresist dry strip product line has been developed to
meet the progressive demands of next generation technology with the
FusionES3. Competitively positioned for wide scale adoption for 300mm
photoresist and dry residue removal, the FusionES3 was fully tested by
the I300I consortium in 1998 and has been demonstrated to meet
industry requirements at the 0.18(mu)m technology node in high volume
production conditions. The FusionES3's unique, low damage microwave
source enables successful process solutions for low-k dielectric
materials and copper. It employs a no-contact, radiant-heated system
that provides excellent temperature uniformity, while enabling
multi-temperature steps within a single process recipe.
"The FusionES3 was engineered for high production manufacturing
environments such as this customer's flagship 300mm facility," says
Pino Spalma, Director of Marketing for Axcelis' Photoresist Processing
product line. "We're very pleased by the rapid market acceptance of
our 300mm product line. This system has already demonstrated
production uptime levels of 95%, and delivers exceptional productivity
benefits when compared to 200mm systems."
According to Gartner Group's Dataquest, a market research firm,
Axcelis Technologies' easy to operate and maintain dry strip product
line realized a 5% market share gain from 1998 to 1999.
Axcelis Technologies, Inc.
Axcelis Technologies, Inc., headquartered in Beverly,
Massachusetts, provides innovative, high-productivity manufacturing
solutions for the semiconductor industry. Axcelis is dedicated to the
design and manufacture of high current, medium current and high energy
ion implantation equipment; fast ramp vertical furnaces and rapid
thermal processing systems; and photostabilization and photoresist
stripping equipment. Axcelis Technologies has manufacturing facilities
in Beverly and Rockville, Maryland, as well as in Toyo, Japan through
its joint venture with Sumitomo Eaton Nova. The company's Internet
address is: www.axcelis.com.
--30--es/bos*
CONTACT: Company Contact:
Axcelis Technologies, Inc.
Elizabeth Burnside
(978) 232-4273
elizabeth.burnside@axcelis.com
or
Analyst Contact:
Axcelis Technologies, Inc.
Jan Paul van Maaren
(978) 232-4213
janpaul.vanmaaren@axcelis.com
or
Agency Contact:
The Loomis Group Inc.
Gabrielle Svenning
(617) 638-0022
gabrielle@loomisgroup.com
KEYWORD: MASSACHUSETTS
INDUSTRY KEYWORD: ELECTRONIC GAMES/MULTIMEDIA HARDWARE
NETWORKING SOFTWARE TELECOMMUNICATIONS MARKETING AGREEMENTS
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