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Technology Stocks : Intel Corporation (INTC)
INTC 39.36-0.1%3:59 PM EST
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To: Paul Engel who wrote (38634)11/3/1997 5:32:00 PM
From: Larry Loeb  Read Replies (1) of 186894
 
Paul,

In relation to:

That would make the Merced about 253 sq. mm in size. and result in 90 to 110 TOTAL POSSIBLE die on an 8 inch wafer (12 inch wafers will come in a few years).

Two questions/comments:

1. In relation to the wafer size, my understanding was that Intel was going to move to 300 mm wafers at the same time they moved to the 0.18 micron process. I seem to remember this being stated by Paul Ottelini (sp?) at the analyst meeting in May (I know I heard/read it somewhere). Do you have more up to date information?

2. In relation to the die size. Do you think that Intel/HP might add another metal layer, or two, to the chip. Wouldn't this reduce the die size further? Would that help/hurt the heat disapation?

Thanks in advance.

Larry
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