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Technology Stocks : Rambus (RMBS) - Eagle or Penguin
RMBS 102.80-4.6%Oct 31 3:59 PM EDT

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To: Elroy who wrote (93611)6/26/2024 12:09:50 PM
From: Doug M.  Read Replies (1) of 93625
 
This one might even be better - it also looks like Rambus has improved on Hynix's heat dissipation
structure:

US20220076714A1 - Methods and Circuits for Streaming Data to Processing Elements in Stacked Processor-Plus-Memory Architecture - Google Patents

<<Thermal management is a serious challenge for this type of design given the high power consumption of both the memory and logic processors. According to experts, intense cooling methods will be needed to support the interface and could take several generations to perfect.>>

SK Hynix Wants to Put Memory and Logic Semiconductors on One Die for HBM4 (sourceability.com)

This is one of the citations in the above patent that was granted a few months ago:

US20210005527A1 - Stacked semiconductor package having heat dissipation structure - Google Patents
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