Formerly About Advanced Micro Devices Message Board

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next

To: Duncan Baird who wrote ()	5/7/2000 12:54:00 PM
From: Alighieri	of 1575706

<cracking Coppermines> from JC <Interesting article here reporting that some Coppermines are literally cracking, likely under heat stress. The article suggests that the problem is inherently caused by flip-chip, but I'm going to slightly counter that by noting that AMD's entire K6 series has been made with flip-chip, and this particular problem that the Coppermine/PIII is currently experiencing hasn't been reported en masse. Other than that, I'm glad that this serious issue has been reported! > Yes, it is my recollection that both AMD and Intel licensed C4 intellectual property (Controlled Collapse Chip Connection> from IBM. It is also my recollection that AMD adopted IBM's process while I believe that Intel did not. I also remember reading that IBM's process was developed over many years and the material science was optimized for the thermal characteristics of the joint formed by the chip C4 and the substrate's pad. Al

Report TOU Violation

Share This Post

Public Reply Prvt Reply Mark as Last Read File

Previous 10 Next 10 Previous Next