Doug, ZDnets Spooner must have been at the same meeting
Ruiz must be butter cause he is on a roll:
zdnet.com
There may have been a time when its small size was a disadvantage for Advanced Micro Devices Inc. But small is nimble, small is quick. And the chip maker's new president is working to exploit AMD's size to speed innovation.
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Intel has employed some use of low-capacitance dielectrics in its 1GHz Pentium III chip. But it will wait until next year to move to copper interconnects. For its part, Intel says copper is not needed until chips reach the next generation manufacturing process technology, known as 0.13 micron. The current generation, is 0.18 micron.
"I'm glad we're doing it now (using copper), because we're learning a lot," Ruiz said.
Fab 30, which began shipping copper this month, is running at about 20 percent of its 5,000 wafer-per-week manufacturing goal, according to Ruiz.
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I think we're very close. We are in the commercial space (now) outside the United States," Ruiz said. "We feel confident that in the second half (of the year) we'll move into the commercial space."
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"If there is anything (Intel) might not have done as well as it could have, it was anticipate demand for its products," he said. Also, Intel "seems to not have a big push on high-frequency parts."
Aside from demand, Intel may have more work to do when it comes to learning how to best manufacturing higher clock speed chips, Ruiz said.
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