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Technology Stocks : Intel Corporation (INTC)

INTC 40.78

+0.7%

Dec 10 3:59 PM EST

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To: Dan3 who wrote (144858)	10/8/2001 12:25:42 AM
From: The Duke of URL©	Read Replies (1) of 186894

Intel announces new chip-packaging technology cbs.marketwatch.com Stuffed pizza BBUL differs from current packaging in its stuffed-pizza approach. Currently, chips are glued onto a package that resembles a small circuit board. The electrical connections between the two parts are accomplished through a series of solder "bumps." The package then connects to the motherboard through a series of pins--the metallic posts you can see on the back of a processor. With BBUL, Intel will dig a trench into the packaging material, insert the microprocessor core, and then encase it in layers of copper and silicon, which perform the same function as the bumps. These layers will be applied through the similar, although less advanced, lithography and etching techniques used to produce the main chip. "This gives Intel a chance to use lithography tools that are much coarser than you can use with microprocessors," which let the chipmaker recycle old equipment, Brookwood said.

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