Significant matters from the S-1:
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Our plan of operations for fiscal year 2001 to finalize the development of our 8, 16 and 32 channel DWDM devices and to bring them to market. We will focus product development on four aspects:
o defining processing steps and conditions (wafer coating, photolithography, etc.) for DWDM devices o readying automation equipment for manufacturing of these devices in our new manufacturing facility o setting quality control criteria for our processes and operations o upgrading our on-site DWDM packaging and fiber pigtailing capability for our optical chips.
We plan to finalize the construction of the clean room in our new manufacturing facility, with the capacity of producing up to 500 devices per day in 2001 and up to 1,000 units per day in 2002, increase our work force to approximately 175 persons to fully staff this facility and launch marketing activities for our DWDM products. As a development stage company, we have not generated product revenues to date and do not anticipate generating product revenues until 2001.
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Employee Growth
We currently have 90 employees. Over the past 12 months, we have increased our corporate division to seven persons. The existing R&D division of 27 meets current requirements and will be increased at a measured pace as we identify new requirements. Most of our personnel growth will be within the operations division, which must increase its manufacturing component of approximately 75 hourly employees and 25 specialists/technicians in order to meet the current sales forecasts for fiscal 2001 and first quarter of fiscal 2002. Headcount growth thereafter will depend on volume requirements and will primarily focus on hourly employees. Most of the manufacturing employees that we will hire will be fully trained in a few months. We intend to increase the remainder of our administrative staff by 35 persons within marketing and sales, engineering, accounting and administrative staff. Combined with the employees remaining at the Dorval pilot facility, the total employee count is anticipated to be in the range of 225 employees by the end of fiscal 2001.
Business Strategy
We believe that there is a substantial market for our devices for DWDM systems. This market may be best supplied using AWG, which provides high channel counts in a single compact device.
Optical chips in AWG format are currently used in DWDM systems. Companies that produce the AWG format are PIRI (a subsidiary of JDS Uniphase), Kymata, Siemens and us. These AWG devices perform in a similar way. However, DWDM devices can differ both in composition and method of fabrication depending on how they are processed. AWG DWDM devices made by PIRI, Kymata and Siemens use a high temperature (greater than 1,000(degree)C) vacuum deposition process called "flame hydrolysis deposition" (FHD). This method of manufacturing optical chips uses a repetition of step by step processing to achieve final composition of a device.
The AWG DWDM devices that we produce differ in composition and method of fabrication. Our AWG devices are made of hybrid sol-gel glass. They are made by spin- or dip coating of fluids and at temperatures about 1,000(0)C lower than those used in FHD. The devices are created by photolithography directly in the hybrid sol-gel glass avoiding vacuum film deposition, and they have optical properties that can be changed over a broader range than those provided by commercial forms of FHD. The latter difference allows us to make smaller DWDM devices (measuring less than 5 cm x 5 cm) than those produced by FHD. Smaller devices permit manufacturers of DWDM systems to make more compact products so their systems can be deployed in locations where space is limited, providing greater design flexibility. The materials and method of fabrication that we use also allow us to make AWG devices more simply (through a simplified process), using less equipment, faster and in larger quantities per unit of processing time than FHD component manufacturers. We believe, at present, that no other manufacturer utilizes the sol-gel method in the commercial production of optic devices for use in the DWDM market.
Our goal is to provide high quality, cost effective and high volume DWDM devices. We developed our PHASIC(TM) process because we believe that high volume manufacturing methods similar to those used by the microelectronics manufacturing industry are necessary to meet telecommunications customer demands for high volume and reliability. We believe that our materials, design tools and process give us a technological edge that will allow us to improve yield in optical chip production.
We have begun producing and testing a limited number of product devices with the intention to market 4, 8, 16, 32 and 40 DWDM product. In addition, we intend to offer services based on our capability to design new customized DWDM devices according to specific client needs. These needs may include, among others, channel count, channel spacing, central wavelength and optical loss characteristics. Because our DWDM is created on a silicon substrate, there is the potential for product enhancement by combining other features such as lasers, on the same silicon substrate.
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Our products will address existing demand and create conditions for expanded use of our devices by using our technology and expertise to develop products for specific client needs. For example, we are presently targeting an existing DWDM market that has for the most part, very specific needs. Because we manufacture our DWDM devices from platform technology, we can use similar materials and processes to produce both devices related generally to the DWDM industry and optical internetworking and customized devices for the DWDM industry. Examples include optical chips for selectively adding or dropping wavelengths (channels) and optical cross-connects.
The platform technology allows us to expand from our DWDM chip into new kinds of optical chip products. We believe that customers may favorably view the idea of having optical devices that are all related to one another through a common (generic) technology. Photonics is a nascent industry and we believe that it will be necessary to work with customers closely to meet their specific needs. In such a competitive industry, we face many risks, including market acceptance of our products and our ability to adapt our products to technological change.
To implement our strategy, we intend to :
o Establish Technology Leadership
There are three primary multiplexer component technologies currently used in DWDMs: thin film filters, fiber Bragg gratings and array waveguides (AWG). According to a report in Laser Focus World Supplement, "WDM Solutions," in 1998, thin filters held a 26% share of the DWDM market, AWG had a 47% share of the DWDM market and Bragg gratings had a 19% market share. Within the industry, AWG technology currently provides the least costly manufacturing alternative to expanding existing capacity over that of thin filter and Bragg gratings technology.
In existing AWG technology, a "flame hydrolysis deposition" (FHD) method is used to manufacture DWDM components and devices. This method employs a hydrogen-oxygen nozzle flame to burn the desired combinations of gases of silicon tetrachloride, phosphorous oxychlorides, chlorides of phosphorous, boron or germanium, for example, that may be transported by a gas like argon to a heated silicon wafer surface. Combustion of the gases produces a glass soot on the surface of a silicon substrate. The soot is melted and consolidated at high temperature (greater than 1,000(degree)C) in a lengthy thermal process. The procedure is repeated at least three times to achieve the final composition. The second coating step is usually followed by a series of coating and vacuum etching steps used to create the AWG component. In some cases, a thin section of polymer (a half wave plate) is inserted into the array waveguide section to desensitize the device to the polarization state of the light.
Thin filters use one-millimeter square glass windows coated with multi-layers of metal oxide. This layered structure is used to pass through some wavelengths of light and reflect others in transferring information or data. These windows act as an optical filter when many are assembled together with lenses and appropriate input and output filters. Then, together they can selectively separate wavelengths of light for transmission of information. In this way, the thin filter device acts in the same capacity as a mutliplexer device.
Bragg gratings act as micro optical filters. The grating spacing is selected in such a way that it allows some wavelengths of light to pass through the filter and reflects other wavelengths of light. When Bragg gratings are created in optical fiber and fibers are assembled together in a structure like an interferometer, the Bragg gratings assembly acts in the same capacity as a multiplexer device.
We believe that the following three variables, discussed in detail below, will determine the relative successes of the above competing technologies:
o Chip manufacturing cost per channel o Size of the optical component o Suitability to high volume manufacture.
We believe that our products, which are based on AWG technology, will enjoy an advantage in each case.
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Chip Manufacturing Cost Per Channel. In AWG technology, cost does not scale with an increase in the number of channels per chip because all channels are created simultaneously or in parallel. There is little increase in the cost of manufacturing an 8-channel, 16-channel or other channel AWG DWDM chip because the circuits and optical channels are all created in the same step. In contrast, in thin filter and Bragg gratings technologies, additional channels must be added sequentially (one at a time), increasing the complexity of the task and adding time and cost to the process. Thus, the current manufacturing cost per channel is lower for AWG technology than for the thin filter and Bragg gratings technologies. The cost of making an AWG DWDM component will depend on the method and materials used. Our products are distinguishable from those of our AWG competitors in their composition and method of fabrication. We believe that our simple one-mask manufacturing process should be cost effective and will be suitable for high volume and high yield manufacturing.
Size of Optical Components. AWG technology products are significantly smaller than those produced by competing technologies. This may prove an advantage where space is at a premium.
Suitability to High Volume Manufacture. Our manufacturing process is simpler, because the complexity of the process does not increase linearly with an increase in the number of channels per chip, as is the case with competing technologies. We anticipate that as optical chip technology matures, customer demand and competition will drive down the price of chips. Our low temperature manufacturing process, which distinguishes it from other producers utilizing the AWG technology, should permit lower cost production and higher product yield.
Our AWG DWDM devices differ from other waveguide DWDM devices in composition and method of fabrication. Our AWG devices are made from different materials (our hybrid glass) and through a different method of fabrication (our low temperature sol-gel process). The use of hybrid glass and the sol-gel processing gives us the advantage of being able to use spin-coating and dip-coating manufacturing methods to cover silicon wafers rather than vacuum deposition techniques. Our hybrid glasses are made at temperatures about 1,000(degree)C lower than those used in FHD chip production. This gives us an energy saving advantage and provides a greater choice in the range of substrates e.g., glass, plastic that might be used in the future to support DWDM devices and future product development. Our DWDM optical chips are created by photolithography directly in the hybrid glass. This avoids complex post-processing sequences in which chemical resists and masks must be used in conjunction with vacuum reactive ion etching methods to create the AWG for the DWDM. The properties of the hybrid glass materials can be altered so that the glasses have properties that are more like those of plastics or inorganic glasses or properties that are intermediate between plastics and glasses. This permits hybrid glasses to be adapted into more commercially usable and compact or miniature forms than those produced by FHD. Smaller DWDM devices also permit manufacturers of DWDM systems to make more compact products.
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Proprietary Rights
Our future success and ability to compete are dependent, in part, upon our licensed and owned technology. We rely in part on patent, trade secret, trademark and copyright law to protect our intellectual property. We are the licensee of three patent applications under the terms of a license agreement with Polyvalor and McGill University expires in October 2017. These three patent applications are:
1. Title: "Solvent-assisted lithographic process using photosensitive sol-gel derived glass for depositing ridge waveguides on silicon" Use: Intellectual property relating to our sol-gel process used to make our optical circuit devices on a broad range of substrates, including silicon through simplified photolithographic processes and wet etching techniques, which is fundamental to the success of our manufacturing process. Country: United States Assignee: McGill University Status: Allowed and issued as patent No. 6,054,253 on April 25, 2000.
2. Title: "Solvent-assisted lithographic process using photosensitive sol-gel derived glass for depositing ridge waveguides on silicon" Use: Intellectual property relating to our sol-gel process used to make our optical circuit devices on a broad range of substrates, including silicon through simplified photolithographic processes and wet etching techniques, which is fundamental to the success of our manufacturing process. Country: Canada Assignee: None Status: Pending. The next step in this patent application is to file the request for examination.
3. Title: "Self-processing of diffractive optical components in hybrid sol-gel glasses" Use: Intellectual property used to make diffraction gratings in hybrid glass without the need for device development steps, which is not material to our present manufacture of products, but is relevant and being sought for later generation products planned for production. Country: United States Assignee: None Status: Pending Provisional: the patent application is pending but is incomplete and the priority date for filing the complete patent application in the United States and for extending the patent application in other countries is October 26, 2000. We are presently in the process of finalizing the application.
We have also filed the following patent applications:
4. Title: "On-substrate cleaving of sol-gel waveguide"
Use: Intellectual property used to make optical coupling between glass fiber and optical circuit device waveguides, which is not material to our present production of products, but is relevant and being sought for later generation products planned for production. Country: United States Owner: Co-ownership between Lumenon and Paul Coudray Status: Pending: the patent was filed on July 1st 1999 and is awaiting review and comments from the examiner. The priority date for filing of the patent application in other countries was July 1, 2000.
5. Title: "Sol gel film coating process using chilled solution"
Use: Intellectual property used to make a sol gel film where the thickness and roughness of resulting film are improved by dispensing a chilled sol gel solution instead of conventionally dispensing such a sol gel at room temperature. We presently use this technology in our manufacturing process.
Country: Canada
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Status: Pending Informal: the patent application is pending but is informal and the priority date for filing the complete patent application in Canada and for extending the patent application in other countries is July 28, 2001.
6. Title: "Flattening the response of a planar wavelength division multiplexer using a Y-junction" Use: Intellectual property used to flatten the response of a planar wavelength division multiplexer through a Y-junction. We presently use this technology in its manufacturing process. Country: Canada Status: Pending Informal: the patent application is pending but is informal and the priority date for filing the complete patent application in Canada and for extending the patent application in other countries is August 4, 2001.
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Agreement with Polaroid
We entered into an agreement dated July 21, 2000 with Polaroid Corporation for the irrevocable non-exclusive license of certain patents held by Polaroid in connection with AWG. We agreed to pay to Polaroid an initial licensing fee of US $395,000 (CDN$584,047). In addition, we will pay royalties on the net selling price of our products, at an annual rate of 5% for aggregate net selling prices of US$5 million, 3.5% for aggregate net selling prices over five and up to US$40 million, and 1.75% for aggregate net selling prices over US$40 million, for each year of the agreement.
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The proceeds of sale of the notes are being used in part to complete the buildout of our new manufacturing facility in Ville Saint-Laurent. Such proceeds will also be used to pursue our overall growth strategy and to finance our research and development program.
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Customer Relations
In addition to the relationship created under the Molex agreements, we will need to work in close association with DWDM system manufacturers. Examples of these manufacturers are Nortel Networks, Cisco, Alcatel, Lucent Technologies, and Ciena. We believe that it will be important to our success to work with customers directly to meet performance requirements in the design of our DWDM products and devices throughout the entire life cycle of our products. This will allow us to foster a strong commitment to service, and to gain insights into our customers' future plans and needs, identify emerging industry trends and consequently deliver high-performance, cost-effective products with wide market appeal. |