Trikon Technologies - TRKN Message Board

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Technology Stocks : Trikon Technologies - TRKN

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To: Zeev Hed who wrote (191)	8/3/1997 10:06:00 PM
From: davesd	of 926

Zeev, I am not sure what exactly the problem is with Cu....But chip designer's would love to use Cu vs Al or Tunsten. At this point Designers would love to use AL vs Tungsten at .25u. As the vias between layers are getting smaller Al is getting harder to use, tungsten's "filling" properties are much better for filling vias, however, it has higher resistance than Al and in "messy" during production requiring several additional steps during the process. The Forcefill technology extends Al usage down to .18u, due to current limitations of PVD tools....FABs are using Tungsten at .30 and below. Cu technology isn't ready for production even though everyone would like to use it....I'll try to find out why Cu is diffcult to use. Does anyone else know?? dave

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