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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 221.56+0.2%Dec 9 3:59 PM EST
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To: grimes who wrote (199314)5/29/2006 7:47:58 PM
From: combjellyRead Replies (2) of 275872
 
"This happens after the wafers are cut into individual die? Die that are successfully tested are then sent (to Malaysia) for packaging, final test, and speed grading?"

I don't know when they bump the chips. Probably after they are diced. After bump and test, they will be flown to Malaysia as you indicate.

Edit: Upon reflection, it probably would be easier to bump the die before dicing.
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