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Technology Stocks : Advanced Micro Devices - Moderated (AMD)
AMD 222.45+0.6%11:26 AM EST

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To: misen who wrote (199329)5/29/2006 10:14:51 PM
From: combjelly of 275872
 
"Bump refers to the formation of solder bumps on the die that the package eventually is connected to"

Actually, I read that tutorial a couple of years ago. Thanks for the link.
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