KLIC news,
K&S Announces Order For Model 8028-PPS Ball Bonders
WILLOW GROVE, Pa., Oct 30, 2001 (BUSINESS WIRE) -- Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC chart, msgs) announced that Siliconware Precision Industries Co., Ltd. (SPIL), a multinational semiconductor assembly subcontractor, has placed orders for 166 Model 8028-PPS ball bonders.
Delivery of the wire bonders to SPIL's Tai-Chung, Taiwan assembly facility will be completed in the December quarter.
According to SPIL Senior Vice President C.H. Wu, the ball bonders will be used to assemble fine pitch ball grid array (BGA) packages for several key customers.
"As a result of decreasing feature size, SPIL requires a solution to bond devices with pad pitch less than 60 microns," Wu said. "We selected K&S equipment because it demonstrated the best productivity and yields on those devices."
"The need for leading-edge ball bonding capability continues to be critical for next-generation devices," said Jack Belani, K&S vice president and president of the company's Wire Bonding Division. "SPIL is an important, long-term customer, and their selection of the 8028-PPS further validates the machine's technological superiority."
Kulicke & Soffa is the world's leading supplier of semiconductor interconnect equipment, materials and technology. Chip and wire solutions combine wafer dicing, die bonding and wire bonding equipment with saw blades, die collets, wire and capillaries. Flip chip solutions include wafer bumping technology, die placement equipment and Ultravia(TM) high density substrates |
