Some news....
( BW)(DENSE-PAC-MICROSYSTEMS)(DPAC) Dense-Pac Microsystems
Enters Global Positioning System -- GPS -- Market with Order from OEM
Customer Utilizing "M-Densus"
Business Editors/Computer Writers
GARDEN GROVE, Calif.--(BUSINESS WIRE)--Nov. 25, 1997--Dense-Pac
Microsystems Inc. (NASDAQ:DPAC) today announced that a California- based OEM
customer has placed an order for its patented "M-Densus" technology for use in a Global
Positioning System (GPS).
This represents Dense-Pac's first sale into the GPS market. The Dense-Pac memory device is
to be used in airborne vehicles. For competitive reasons, the customer's name was not disclosed.
The U.S. GPS Industry Council recently announced that the worldwide market for the GPS
receiver equipment is expected to grow to over $8 billion by the year 2000, with most of the
growth in the commercial and consumer sectors, which will eventually account for 60% of the
market.
Uri Levy, chairman and chief executive officer of Dense-Pac, stated, "This customer's Global
Positioning System needed to be very compact and our space-saving technology achieved their
objective. Here again, we're taking this flexible M-Densus product and penetrating a new
market. We are doing it over and over and over again. The vertical markets that this technology
can be applied to are numerous, and we will continue to pursue expansion within this market and
penetrate new ones."
The applications of GPS are numerous and their popularity is growing. GPS receivers are now
fitted in some luxury cars, complete with digitized street maps on CD-ROM to help the driver
reach his destination. GPS receivers will soon be integrated into cellular phones, and are already
in use in boats, private and commercial airplanes, vehicle tracking systems, and modern-day
compasses for hiking.
M-Densus is a family of interchangeable high density memory devices that fit in the same
space -- or footprint -- on a memory board but provide up to eight times more capacity than
currently available memory devices. Dense-Pac recently received the Editor's Choice Award
from Semiconductor International magazine for its M-Densus.
Dense-Pac Microsystems Inc. designs and manufactures proprietary and patented
three-dimensional high density memory products that allow the company's commercial, industrial
and military customer to pack huge amounts of memory into small spaces. Its commercial
products include applications such as cellular phones and other hand-held personal
communications, laptops and notebooks, super computers and servers, digital cameras, portable
electronic organizers, storage devices, electronic keyboards and digital sound systems, medical
instrumentation, airborne and space avionics and such diverse applications as space satellites and
space missiles, and high performance auto engines. The company's web site is at
www.dense-pac.com .
Note to Editors: Statements regarding the company's expectations about growth and
marketing strategies, new and existing products, future financial performance and other
forward-looking statements are subject to various risks and uncertainties, including without
limitation, demand and acceptance of new and existing products, technological advances and
product obsolescence, availability of semiconductor devices at reasonable prices, competitive
factors and the availability of capital to finance growth. These and other risks are discussed in
greater detail in the company's filings with the Securities and Exchange Commission. |
