re: Semiconductor technology marching on (Infineon, AMD, UMC).
* Currently the size of the smallest element on a chip is 130 nanometer headed for 90 nm.
* Next generation wafers are 300 millimeter.
* The first chips using 65 and 45 nm nodes. are likely to be produced in 2005
>> Infineon, AMD, UMC Team Up on Semiconductors
30 July, 2002
Frankfurt
Reuters
Germany's Infineon Technologies IFXGn.DE said on Tuesday it had teamed up with AMD Inc. AMD.N and Taiwanese foundry UMC to develop technology to produce the small structures in next generation chips.
Infineon said the development program on 65/45 nanometer manufacturing platform technologies -- would take place at United Microelectronic Corp.'s 2303.TW UMC.N facility in Hsinchu, Taiwan, where later the chips will be produced.
The first chips using structures made from the technology are likely to be produced in 2005, an Infineon spokesman said.
He added that as the number of elements on a chip doubles every year, semiconductor makers are under pressure to develop new microelements to fit on chips, which are also shrinking. At the moment the size of the smallest element on a chip is 130 nm.
The nanometer technology will help produce logic products on next generation 300 millimeter wafers.
"With this joint program, Infineon again demonstrates its commitment to focused cooperation in order to strengthen our leadership position in the semiconductor industry," said Ulrich Schumacher, Infineon's chief executive in a statement.
Infineon said it was expanding on an existing agreement it has with UMC, the world's second largest foundry, to develop 130/90 nanometer process technology and will join the program AMD and UMC announced earlier this year for 65 and 45 nm nodes.
Advanced Micro Devices brings know-how from its microprocessing technology, said an Infineon spokesman. AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets. <<
- Eric - |
