Doug, do you read anything directly, or indirectly positive with this article about Flip Chip? I see they are all doing things down in Phoenix, including Innovex. It was my understanding that flip chips have been a good idea which hasn't met actual market demand. Could this be an early indicator that things will begin?
Regards,
Mark
ASE Completes Flip Chip Technology Transfer
August 2, 2000 07:31 AM Eastern Time
WILLOW GROVE, Pa.--(BUSINESS WIRE)--Aug. 2, 2000--Kulicke & Soffa Industries, Inc. KLIC and Flip Chip Technologies, LLC (FCT) announced successful completion of the first wafer bumping and redistribution technology transfer to Advanced Semiconductor Engineering Inc.'s flip chip factory in Kaohsiung, Taiwan.
ASE, one of the top IC packaging foundries worldwide, will use FCT's proprietary Flex-on-Cap (FOC) wafer bumping and redistribution (RDL) technologies to manufacture advanced flip chip BGA packages for both performance and form factor driven applications.
The technology license, announced in May 1999, provides for transfer of the FOC and RDL techhnologies employed by FCT in its Phoenix facility, along with all required documentation, training and engineering support. Line implementation and training began in July 1999.
According to FCT Vice President Don May, ASE is bumping wafers ranging from 4 to 8 inches in diameter. Based on recent data, ASE is now achieving yields in excess of 99.5%, equilivent to FCT's own wafer fab yields.
ASE General Manager K.J. Chin said, "FCT's wafer bumping process has proven extremely robust and inherently high yielding. Their Technology Transfer Group worked closely with our management and engineering staff to bring our line up in record time."
"FCT's technology is catching on for both high- and low-end devices, and everything in between that is performance or form factor driven," May said. "ASE's fast ramp demonstrates the flexibility and adaptability of our process. The top three semiconductor assembly subcontractors have licensed Flip Chip Technologies' wafer bumping process, and we expect comparable results at the other two sites when their lines come on-stream later this year."
Based in Phoenix, AZ, FCT is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry.
A joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, FCT offers proven merchant wafer bumping services and technology licensing used in applications requiring higher performance, reduced form factor, and lower costs than those obtainable through other techniques. For more information on FCT visit www.flipchip.com
Kulicke & Soffa is the world's largest supplier of semiconductor assembly equipment. The company provides scaleable solutions for the assembly of chip and wire, flip chip and chip scale packages. Kulicke & Soffa's web site address is www.kns.com
CONTACT: Kulicke & Soffa Industries, Inc., Willow Grove Media Henri Van Parys, 215/784-6818 parys@kns.com or Analysts Nancy R. Kyle, 215/784-6436 nkyle@kns.com |
