Major Taiwanese Foundry Places Additional Orders for Mattson Technology's 300 mm Aspen III Highlands and Strip Systems
Tuesday July 15, 8:32 am ET
Systems to be Used for FEOL and BEOL Processing for Foundry's 300 mm Fab Ramp
FREMONT, Calif., July 15 /PRNewswire-FirstCall/ -- Mattson Technology, Inc. (Nasdaq: MTSN - News), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has received a follow-on order for 300 mm Aspen III Highlands and Aspen III Strip systems from a major Taiwanese foundry. The systems will be used for front-end-of-line (FEOL) and back-end-of-line (BEOL) advanced low-k/copper cleaning applications in the foundry's 300 mm production facilities. System deliveries are expected to begin shipment by the end of July 2003.
"Our Aspen Strip systems are widely used throughout this foundry's 200 mm and 300 mm fabs, where they play a key part in manufacturing of its most advanced chips," said Bruno Doetsch, senior director of Asian (China, Taiwan, Southeast Asia) operations of Mattson Technology. "We have worked closely with our customer to qualify the Aspen III Highlands for high-volume foundry production, and the system's low-k/copper processing capabilities and high productivity were important factors in the selection of the tools. This repeat order is an acknowledgement of our strip technology leadership in both FEOL and BEOL platforms from one of the world's recognized foundry leaders. We are pleased to continue our strong relationship with this customer by providing advanced strip systems that will help accelerate the ramp of its 300 mm manufacturing."
About the Aspen III Highlands
The Aspen III Highlands is an advanced 300 mm system used for removing resist, residue and barrier layer for low-k/copper applications. Built on Mattson's production-proven, high-throughput Aspen III platform, the Highlands features a proprietary ICP technology for optimal uniformity and low damage. The system's modular design allows process modules to be added for greater production capacity and process flexibility. The Highlands' dual-wafer processing capability provides the industry's leading productivity-virtually twice the throughput of competitive low-k capable systems. The Highlands' ability to reduce operational steps simplifies integration and provides customers unparalleled total cost of ownership (TCO).
About the Aspen III Strip
The Aspen III Strip system features Mattson Technology's proprietary inductively coupled plasma (ICP) source that effectively strips resist and residue, reducing the need for post-strip chemical processing. The system achieves excellent results for high-dose implant strip, residue removal and surface cleaning for advanced applications, including low-k and oxygen and non-oxygen-based processes. The Aspen III Strip system offers advanced technology on a high-throughput platform, providing process performance and low cost of ownership advantages to chipmakers for advanced device manufacturing.
About Mattson Technology, Inc.
Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company's core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: 800-MATTSON / 510-657-5900. Fax: 510-492-5911. Internet: www.mattson.com.
CONTACT: Lauren Vu, PR Manager of Mattson Technology, Inc., +1-510-492-6518, or fax, +1-510-492-2800, or lauren.vu@mattson.com.
Source: Mattson Technology, Inc. |
