Mattson Technology Equips Winbond's New 300 mm Fab
Tuesday August 23, 8:45 am ET
FREMONT, Calif., Aug. 23 /PRNewswire-FirstCall/ -- Mattson Technology, Inc. (Nasdaq: MTSN - News), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has installed multiple Helios RTP and Aspen III ICPHT and Strip systems at Winbond Electronics Corporation's new 300 mm fab in Central Taiwan Science Park in Taichung, Taiwan. The systems will be used to produce DRAMs, mobile RAM and flash memory products at the 110 nm node, with extendibility to 90 nm and beyond.
"We selected Mattson's strip and RTP systems based on their excellent processing performance, reliability, technology extendibility and cost-of- ownership," said Dr. Victor Wang, Winbond's 300 mm fab director. "We believe that Mattson's advanced technology and world-class support will play a critical role in helping us ramp our 300 mm fab to mass production."
"Winbond's selection validates its confidence in our technology expertise to deliver high-performance, low cost-of-ownership strip and RTP systems that will enable it to achieve volume production success through several device generations," said Ming C. Kao, Mattson Technology's Taiwan country manager. "We are looking forward to strengthening our market-leading position in Taiwan by providing our customer the leading-edge, scalable systems required to meet its aggressive production goals down through the 90 nm node." |
