Ericsson gains access to multi-layer technology with invest in Merrimac Industries
By Semiconductor Business News
Apr 10, 2000 (7:15 AM)
URL: semibiznews.com
STOCKHOLM, Sweden--LM Ericsson today announced it was investing $3.4 million in Merrimac Industries Inc. of West Caldwell, N.J., to gain access to a new multi-layer process for microwave components, multi-layer ICs and modules in mobile telecom applications. Ericsson's purchase of 375,000 shares at $9 each will give the Swedish company 17.5% of Merrimac's outstanding common stock.
Merrimac's Multi-Mix technology uses fusion bonded multi-layer structures to produce components and subsystems at a fraction of the size and weight of conventional microstrip and stripline products, according to Ericsson Microelectronics, which plans to use the concept in its product portfolio.
The combination of Ericsson's wafer processing and wireless expertise with Multi-Mix technology will enable the company to "provide our customers with even more consistent and more functional RF components and modules," said Bo Andersson, vice president and general manager of Ericsson Microelectronics AB. "Potential applications include our HIT (High Impedance Technology) product lines as well as our industry-leading Bluetooth transceivers," he added.
"By forming this close partnership with Merrimac we expect to speed our time to market with new and higher value products that will further demonstrate our leadership in the microelectronics industry," Andersson said.
Merrimac has been increasing its capacity and it has implemented "significant operational efficiencies," said Mason N. Carter, chairman and CEO of the New Jersey company. "We are now planning to further expand Multi-Mix processes to accommodate higher volumes of components, assemblies and Micro-Multifunction Modules (MMFM) that we expect this relationship will generate," Carter said, referring to Ericsson's acquisition Merrimac's shares. |
