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Technology Stocks : AMD:News, Press Releases and Information Only!

AMD 207.58

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3:59 PM EST

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To: Adrian Wu who wrote (4031)	1/23/1998 10:33:00 AM
From: Elmer	of 6843

<Elmer: The current K6 based on 0.35 micron process has a die size of 188mm^2, the new K6+3D will have a die size of 133mm^2. The die size of the K6-3D will be 88mm^2. All the die sizes are smaller than the corresponding Intel products because AMD uses a 5-layer CMOS process vs. Intel's 4 layers.> From a cost standpoint, what good is a smaller die when your throughput is slower, your yields are poor and your fabs are built with borrowed money? You may get bragging rights but that doesn't help the bottom line. EP

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