Jack,
Appreciate the Barbash article regarding Tech sector knowledge... He and many others see Bluetooth as a viable technology and potentially lucrative investment theme. Therefore, the fact that two GTR choices (CNXT,ATML) are solid Bluetooth plays should be of interest...
>>>>>>>>>>>>>
streetadvisor.com
How to Get in On Bluetooth
David Wilbur
Apr 20 2000
Remember Bluetooth, that clever technology we told you about last month that will let all your high-tech toys talk to each other? We know you really want to get in on any investment opportunity there, but until now the only option has been buying shares of the companies that will benefit from Bluetooth, such as Motorola [MOT], Nokia [NOK], and Vodafone AirTouch [VOD]. That?s about to change.
One of the companies out in front of the pack as a developer of RF semiconductor solutions for personal wireless connectivity is Philsar Semiconductor, which makes chips that enable the use of Bluetooth in consumer devices. This privately held Canadian company has developed the world?s lowest-power Bluetooth radio, making it a perfect solution for digital cellular handsets and other mobile Internet devices. In addition, its portfolio of products includes RF components for third-generation digital cellular handsets, building blocks for CDMA systems, and global positioning products.
Yes, we did say the company is private, but here?s where you come in: last week Conexant [CNXT] announced it would acquire Philsar. And you can invest in Conexant, which is the world?s largest independent company focused on semiconductor solutions for communication electronics. With the addition of Philsar, it is positioned to capitalize on the innovation Bluetooth will bring to the marketplace. The Philsar team will be part of Conexant?s wireless communications division, which provides a number of products for the digital cellular and cordless telephone market.
Conexant is also the world?s largest supplier of Gallium Arsenide (GaAs) devices for wireless communications and optical networking. This is the technology of choice for power amplifiers for digital handsets, third-generation wireless products (which allow broadband connection to the Internet), and fiber-optic transceivers for Internet equipment. The company recently increased its wafer start capacity?which directly affects the number of chips it can produce?from 15,000 last year to 125,000 this year.
Based on its current product line, the additional GaAs capacity, and the acquisition of a leader in Bluetooth design, we continue to rate Conexant a buy. <<<<<<<<<<<
>>>>From Electronic Business Asia magazine....
eb-asia.com
WIRELESS
Cutting its teeth
THE Bluetooth standard for short-range wireless communication between electronic devices is becoming a market reality this year. Blue-tooth promises to enable instant and cable-free connections between systems such as computers, mobile phones, PDAs and telecommunications systems.
According to market research firm Allied Business Intelligence, the Bluetooth market could exceed $2 billion by 2004. According to Allied, the rapid decline in Bluetooth module cost, at $30 initially and falling to $5 within a few years, will be one of the keys to growth. The standard has the support of industry giants such as Ericsson, Nokia, IBM, Toshiba and Intel.
According to Joyce Putscher, director of the converging markets and technologies group with Cahners In-Stat Group, Bluetooth IC shipments will pick up in the first half of 2000, with the first supporting equipment appearing in the second half. "Bluetooth really will begin to sink its teeth into the market in 2001," says Putscher. "If acceptance in the marketplace goes well, the manufacture of Bluetooth-enabled equipment could exceed 400 million units by 2004."
One of the first chip vendors to announce supporting products, TEMIC Semiconductors, has introduced a short-range RF transceiver for the radio portion of Bluetooth systems. The company is also developing a silicon germanium frontend, which will include a power amplifier and low-noise amplifier.
Atmel, the parent company of TEMIC, is providing another Bluetooth solution consisting of a reference design based on a multi-chip module that includes radio, baseband and flash memory in a BGA package, as well as other key components assembled on a small PCB. Atmel has indicated that it will provide Bluetooth software through the host controller interface (HCI) and develop software through the logical link control adapter protocol (L2CAP) level for qualified customers.
According to Richard Bisset, Atmel's Bluetooth marketing director, "In contrast to other Bluetooth vendors, Atmel has no plans to vertically integrate its Bluetooth solution into an end product. As a result, we have no conflict of interest with any of our customers.''
That statement may have been aimed squarely at Ericsson, one of the founding Bluetooth members, which is proliferating its own silicon architecture through foundries and chip vendors. <<<<<<<<<<<<<<<<<<<<<<<<<<<< |
