Thin is in...
(COMTEX) A: TOSHIBA LAUNCHES SMALLEST, THINNEST CMOS LOGIC PACKAGE
A: TOSHIBA LAUNCHES SMALLEST, THINNEST CMOS LOGIC PACKAGE
Jul 26, 1999 (Asia Pulse via COMTEX) -- (Full text of statement.
Contact details below)
TOKYO, July 26 Asia Pulse - Toshiba Corporation announced that it has
started to ship the world's smallest and thinnest 16-pin and 20-pin
CMOS logic chip packages.
The 16 (US16) and 20-pin (US20) packages have a footprint more than 30%
smaller than similar packages. Toshiba will make them available in five
families supporting 74 models, and will start mass production in
September. Commercial samples are available now.
"Smaller" and "thinner" have become the central concerns of a
semiconductor industry seeking to meet the dramatic growth in demand
for more compact mobile equipment.
With the 3mm x 4mm x 1mm US16 and the 3mm x 5mm x 1mm US20, both with a
0.5mm in pitch supporting simpler assembly, Toshiba has taken a large
step toward meeting current demands.
The new packages will be applied to packaging of multiplexers, decoders
and 8-bit buses for more compact, lighter portable products, such as
notebook and sub-notebook PCs, PDAs, cellular phones and LCDs.
These packages are supplied on an emboss taping reel containing 2500
packages.
Toshiba Corporation Corporate Communications Office 1-1-1, Shibaura,
Minato-ku,
Tokyo 105, Japan Telephone : 81-3-3457-2105 Fax : 81-3-3456-4776
Internet : toshiba.co.jp
(Nikkei)
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(C) 1999 Asia Pulse Pte Ltd
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