To All,
300mm seems to be alive and well...
NEC gets China fab partner
By
Shanghai, China - NEC Corp. and Shanghai Hua Hong Microelectronics
will build a 0.35-micron fab, the so-called "Project 909," which has been
a top priority of the Chinese Ministry of Electronics Industries for its
upcoming Five Year Plan.
According to news reports from Beijing, the Chinese government is
expected to invest about 71 percent of the expected $700 million cost of
the 8-inch facility, which will process 20,000 wafers per month by
mid-1998. The plant is expected to be built in the Pudong Development
Zone in Shanghai.
Selection scramble
During the past year, several of the top U.S. and Japanese
semiconductor companies have vied to be the chosen partner for the
project. NEC operates another joint-venture fab, Shougang-NEC, which
began front-end and assembly operations in 1992. That fab now
produces 4-Mbit DRAMs on 6-inch wafers, using 0.7-micron process
rules, and assembles memory and logic chips sold in the Chinese market,
said an NEC spokesman. NEC officials said that the basic outline of the
deal has been agreed to.
Japan's Electronics Industries Association forecasts that China's
semiconductor market will triple between 1995 and 2000, to total nearly
$15 billion by the end of the century.
Copyright r 1997 CMP Media Inc. |
