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Technology Stocks : Micron Only Forum
MU 237.16+4.6%Dec 5 9:30 AM EST

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To: Zeev Hed who wrote (44547)3/29/1999 8:17:00 PM
From: Fabeyes   of 53903
 
>>When you electroplate (or even electroless plate) only the copper seeded area accepts the copper from the electrolyte, thus creating selective filling or "bulking" of copper mass for the conductors.>>

These are very valid points and remain true. I am sure there are several opinions and terminologies out there. I basically think we are saying the same thing.

Thanks for the article.

A good company to watch for this and one a lot of people would not associate with copper anything is Semitool.

They have made rinsers and dryers in the past but are really on top of the copper electroplating "fill". They are located in Montana, by Glacier Park, which too is an odd place to be, but a beautiful one.

Thanks again
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