TI Addresses Silicon's Role in Enabling Internet Era
of Broadband Technologies
TI Executives Open High Speed Access Summit
SOURCE: Texas Instruments Incorporated Semiconductor Group
DALLAS, Feb. 17, Texas Instruments (NYSE: TXN-news;TI) executives opened the High Speed Access Summit in Dallas today, stating that silicon providers are accelerating the broadband access and services markets. TI, the world leader in digital signal processors (DSPs) and analog, expects that the strong demand for all broadband access technologies will continue to benefit from semiconductor technology, increasing the performance and local loop lengths, and reducing power and size of systems for both the central office (CO) and customer premises equipment (CPE).
Marc Cetto, director of marketing and applications for TI's Broadband Access Group will chair the second day of the conference, and his opening remarks will set the tone of the day's presentations: maximizing the local loop. John Scarisbrick,senior vice president of TI, will begin the TI presentation by defining silicon's role in enabling the Internet era of high- speed access.
George J. Barber, vice president and general manager of TI's Worldwide Broadband Access Group, will follow with a presentation on how TI is enabling manufacturers and service providers to deliver next-generation services such as toll-quality voice, streaming audio and video, and high-speed data. These next-generation services will more easily enable two-way video-conferencing, Internet sharing, broadcast-quality video, telemedicine, distance learning, e-commerce and telecommuting.
"Broadband infrastructure requirements demand silicon innovation in order to provide digital services within the power and space constraints of a central office,'' says George Barber. "TI's system-on-chip capabilities are re-writing the rules of
broadband. Complete solutions that utilize TI's world-leading DSPs, analog and semiconductor process technology, along withthe necessary software, are about to create a world of more appealing applications for service providers and consumers."
Addressing key broadband infrastructure concerns, Barber will explain how silicon will ultimately change the economic picture of broadband access over the last mile, and change it significantly. For example, in the central office TI currently offers four modems on a single programmable DSP core. As a result of new silicon innovations, soon TI's central office offerings will expand to include eight modems on a chip and beyond.
Silicon will not only change the economics of broadband access on the client side, it is going to change the whole psychology of
getting a broadband connection. Tomorrow's DSL and cable modem solutions will be software driven, so consumers will not
have to worry about installation problems. The programmable DSP in all CPE devices will allow for auto-provisioning, auto-connecting and auto-upgrading, enabling consumers to receive new services such as toll-quality voice, streaming video,streaming audio and high-speed data to the home or office.
"Advances in silicon technology will take much of the pain out of the equation for consumers to acquire broadband access," says Barber. "Thanks to advances in DSP technology, consumers won't need an ungainly black box to hook up their DSL service, instead the technology will be so compact and so affordable that it will be built right into the devices they buy.
Following the history of the analog modem market, this could mean that the consumer DSL services industry could be larger than a $1 billion market very quickly -- all driven by the performance of TI DSPs.''
"Programmable DSPs will play a key role in the development of the DSL market. Programmability means that service providers can future-proof their networks with a simple code-load upgrade to allow quick and cost-effective deployment of next-generation services," explains Barber. "Programmability also means that there will be a flood of new features and network-ready devices coming into the market, such as residential gateways, entertainment devices, security systems,networked appliances and every type of service that consumers will be willing to pay extra for."
Leading telecommunications equipment manufacturers such as Siemens, Ericsson, Samsung and Hyundai have chosen TI's DSP-based DSL solutions for their CO products. IBM, Boca Research, Efficient Networks and Legend, China's largest PC manufacturer, have chosen TI DSL solutions for their client side DSL products. Additionally, TI DSPs lead the industry in providing voice over DSL (VoDSL) capabilities, with four out of five VoDSL vendors including Accelerated Networks,
CopperCom, Flowpoint and Jetstream utilizing the low- power and high performance of TI DSPs for their leading VoDSL solutions.
"The broadband era is just beginning, with new services and new business opportunities opening up everyday for service
providers," Barber says. "TI's advances in silicon will continue to pave the way and drive the market to new heights."
For more information on how TI's DSP-based broadband access solutions are accelerating the broadband market, please visit the TI Web site at ti.com. |
