Update on IBM in Smart Cards
Smart Card news item found on Yahoo -IBM In Smart Card Test With U.S. Govt.
NEW YORK (Reuters) - International Business Machines Corp. (NYSE:IBM - news)
says it is set to offer a pilot group of
employees at the U.S. government's purchasing agency new smart cards combining
commercial and government applications.
The agency, the General Services Administration (GSA), plans to test the IBM
technology with 450 employees.
Smart cards are a new generation of credit cards containing a computer chip capable of
performing multiple functions such as storing financial data and
personal information as well as acting as a secure identity card.
While popular in Europe, the technology has been slow to catch on in the United States.
The U.S. government has sought to boost acceptance through
demonstration projects using government employees and military personnel.
The GSA plans to test the IBM smart cards to act as employees' badges, among other
uses. Swiping the card in front of special readers will give the
employee access to secure buildings.
The cards will also be used for computer security, giving employees access to personal
computers and the computer network. The cards would store
digital signatures that enable employees to ''sign'' electronic documents.
The smart cards will be backed up by biometric technology requiring employees to
prove their identity with fingerprints rather than passwords when
using computers.
The smart cards will be provided by Siemens AG's Siemens Microelectronics Inc. One
side will look like the traditional Citibank -branded Visa card with
a magnetic stripe for purchases.
The other side will contain a chip running a new version of the Java Card operating
system developed by IBM.
Under an agreement with at least one airline, the card can be used as a substitute for a
boarding pass at the gate, using software on the card that
contains personal boarding information.
Read up on the CTST conference in Chicago from May 11-14th at
www.ctst.com.
Now carefully read this news release from Nanopierce:
Nanopierce Technologies Inc. Announces Major Technology Agreement
DENVER--(BUSINESS WIRE)--April 19, 1999--Nanopierce Technologies Inc. (OTC
BB:NPCT) today announced it has closed an Application Development Agreement
with Multitape GmbH & Co. KG, Paderborn, Germany, one of the world's leading
manufacturers of components used in the manufacturing of Smart Cards.
Under the Agreement, Nanopierce and Multitape will develop a chip module
substrate tape utilizing Nanopierce Connection System for Dual Interface
Smart Cards. A leading smartcard manufacturer has agreed to conduct field
trails on the product designed to qualify it for ISO 9000 standards and
eventual commercial production.
Multitape is an established supplier of chip module tapes and antenna coils
for use in Smart Cards to many manufacturers, including such industry leaders
as Siemens Semiconductor Group (Germany) (SMAWY, OTC BB:Foreign), Philips
Semiconductors (Holland) (NYSE:PHG - news), Orga Kartensysteme, GmbH
(Germany) and PPC Card Systems, GmbH (Germany).
Dr. Herbert J. Neuhaus, executive vice president of marketing and technology
said, ''This venture with one of Europe's most innovative participants in the
Smart Card industry presents Nanopierce with a strategic opportunity to
insert its technology into the products of multiple manufacturers. We intend
to become the standard for chip to antenna connection technology in the
multi-billion dollar, worldwide, Smart Card industry which is now
experiencing explosive growth.''
Dr. Neuhaus noted that according to the respected market research firm,
Killen & Associates, the worldwide market opportunity for smart card
manufacturers will grow at a 59% rate (CAGR) typical of emerging markets to
$7.6 billion in 2000, reaching $16 billion in 2005.
Nanopierce owns eleven patents, six pending patent applications, two patent
applications in preparation and other intellectual properties, relating to
its Nanopierce Connection System (NCS). This advanced system is designed to
provide a significant improvement over conventional electrical and mechanical
interconnection methods for high-density circuit boards, components, sockets,
connectors, semiconductor packaging and electronic systems.
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Contact: Nanopierce Technologies Inc., Denver
303/592-1010 |
