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To: Pravin Kamdar who wrote (5225)10/2/1997 9:56:00 AM
From: Bill Jackson   of 213173
 
Pravin; A change to copper will affect the heating of the chip. If you change the clock frequency upwards and measure the heat out put as you go you can readily calculate when it will get so hot on the die that heat augmented diffusion will cause the N and P areas to expand/contract and the transistors making up the chip to fail. If you use copper it electricity conducts better(less heat) and allows heat to be conducted away better.In addition if they make the traces smaller, the heating is also less, and the time to travel is less These four might go together to allow a 300 MHZ CPU to reach 500MHZ.
A lot depends on the design of the chip for speed. At 500 MHZ you get strange radiative effects, and couplings that are lessened at lower frequencies. Thus you cannot just take the artwork and do it in copper and small micron size and hope for more than a 50% (about )potential speed increase. Often the silicon die needs layout changes, which takes time and testing. Coppers time is coming and several foundries in addition to IBM will roll it out over the next few years. For real speed gold on diamond used by the military has the highest speeds and best heat dissipation, but it costs a lot. They are working on deposited diamond films on a gold base to get enhanced heat dissipation(Diamond is a very good insulator and also a good heat conductor, so a diamond layer on gold allows the Si to dissipate heat very well, and go faster)

Bill
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