Ian, wasn't he also adamant that flip-chip is the future a couple of years ago? But he may have learned since then. :)
From the K&S flip chip web site description you wouldn't think they're trying to sell it.
kns.com
The Flip Chip Revolution
According to TechSearch International Inc., the market for solder bump devices, including wafer level packages, will approach 10 billion units in 2005. The accelerating growth of flip chip technology, coupled with the growth of chip size packages, drives the need for increased contract bumping services.
Experience the K&S Flip Chip Advantage
From wafer bumping services, technology licensing, and stud bumping equipment — to innovations in copper and low-k dielectric — K&S offers complete flip chip solutions for IC manufacturers, subcontract IC assemblers and end-product providers. K&S is the market leader in solder wafer bumping and intellectual property, and is positioned to continue providing leading-edge solutions for a full range of flip chip applications.
As the flip chip technology leader, we deliver proven bumping technology for applications requiring higher performance, reduced form-factor and greater density than those obtainable through traditional surface mount technologies. Our customers have access to all the services and expertise to use flip chips successfully — from design through implementation to final product. Many companies have chosen to license our ultraCSP® and Wafer Level Packaging processes. Incorporating our standard-setting technology into their applications enables our customers to achieve their flip chip processing goals — today and into the future.<
Gottfried |
