Foundries eyeing DRAM fabs
Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Thursday 24 November 2011]
DRAM chipmakers Powerchip Technology and ProMOS Technologies are reportedly considering selling fabs in order to preserve cash and strengthen their financial structures. Bidders for their facilities include Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), Globalfoundries and Vanguard International Semiconductor (VIS), according to industry sources.
Globalfoundries appears to be the latest bidder, expressing its interest in the fabs, the sources indicated. TSMC, UMC and VIS reportedly have been eyeing 12-inch facilities from local DRAM firms in Taiwan, offering prices between NT$9 billion (US$297 million) and NT$12 billion.
Powerchip currently has three 12-inch wafer fabs at the Hsinchu Science Park (HSP), northern Taiwan while ProMOS' 12-inch wafer fab is located in Taichung, central Taiwan.
Powerchip's debts, mainly owed to banks, now total about NT$46 billion. The firm recently began to negotiate with bank creditors for a fresh extension on the repayment of loans.
ProMOS' debts have totaled NT$67 billion, of which NT$57 billion is borrowed from banks.
In other news, rumors are also circulating that Rexchip Electronics might acquire Powerchip's P3 fab to help Powerchip ease its financial burden. Both Rexchip and Powerchip use Elpida Memory's designs to manufacture DRAM, with the former also acting as a production subsidiary for Elpida. |
