SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Kopin Corp. (KOPN)
KOPN 2.595+1.4%3:59 PM EST
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: kinkblot who wrote (672)5/6/1999 3:52:00 PM
From: John Finley  Read Replies (1) of 1820
 
So that's how they do it! SOITEC anyway. I'd never heard of hydrogen delamination induced splitting. Of course that means you have to have an ion implanter handy but that's not a problem for today's foundries. I'd bet KOPN uses something similar as long as the ~600C anneal isn't prohibitive once the circuit is in place. SOITEC claims they can do it on 200mm (300mm?) wafers and get <5% thickness uniformity.

This is neat technology! Thanks yet again, Will. You are a wealth of great information.

JF
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  

HomeMailHotSubjectMarksPeopleMarksKeepersSettings
Terms Of UseContact UsCopyright/IP PolicyPrivacy PolicyAbout UsFAQAdvertise on SI
© 2026 Knight Sac Media.  Data provided by Twelve Data, Alpha Vantage, and CityFALCON News