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To: Gary Hoyer who wrote (7198)10/29/1997 5:43:00 PM
From: BillyG  Read Replies (1) of 25960
 
NEC is making .28 micron 16M SDRAM -- the smallest die size yet. Companies know they need .25 micron equipment to make money............

techweb.cmp.com

A service of Semiconductor Business News, CMP Media Inc.
Story posted at 2 p.m. EDT/11 a.m PDT, 10/29/97

NEC claims smallest 16-Mbit DRAM die

TOKYO -- NEC Corp. this week fought back against Micron Technology
Inc. by shrinking its 16-Mbit synchronous DRAM to a smaller 30 square
millimeter size, enabling the Japanese chip maker to cut costs and raise profit
margins on a lower price SDRAMs.

NEC leapfrogged Micron by using 0.28-micron process technology to
achieve what the firm claimed is the world's smallest die size 16-Mbit
DRAM. Micron used a 0.35-micron process earlier this year to shrink its
DRAM die to cut prices aggressively and still gain 41% profit margins.
Micron is shifting to 0.3-micron production technology for even further die
shrinks, but this still is slightly larger than NEC's latest 0.28-micron feature
size.

NEC is sampling its new 30-sq.-mm DRAM and expects to be in
production early next year. The NEC lead in the shrink race may be
short-lived. Major DRAM producers are rushing to launch 0.25-micron
production lines, which could yield even larger numbers of smaller DRAM
die sizes early next year.

Separately NEC is developing a chip scale package (CSP) DRAM version
for the growing hand-held PC and wireless communication markets. CSP is
increasingly being used for flash memory ICs, but NEC is one of the first
firms extending the new ultra-small package to DRAMs.
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