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Politics : Formerly About Advanced Micro Devices
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To: Yousef who wrote (72370)9/20/1999 2:56:00 AM
From: Process Boy   of 1574060
 
Yousef - <There are tremendous differences in ILD gap fill
between copper damascene and traditional Aluminum processing. In fact,
this is one of the major processing advantages of damascene. The reason is that once you have etched a trench, filled with copper, and then polished ... You have a very flat surface on which to deposit the next ILD. Expensive, complicated ILD deposition techniques are not needed in damascene processing.>

Thanks for the explanation on the merits of damascene, which is, as you've implied, a very elegant topographical feature.

PB
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