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Politics : Formerly About Applied Materials
AMAT 304.08+2.2%Feb 5 3:59 PM EST
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To: Rob-Chemist who wrote (8131)9/24/1997 1:27:00 AM
From: Anand Srinivasan   of 70976
 
u are right about the Cu lines being formed by CMP.
from the SEMs that is there on the IBM home page
it looks like IBM is using dual damascene process.
the seed layer appears to be some PVD layer(cusps
very fast) - so it could be Ti/W/TiN or Cu.
FYI - IBM has all the basic patents on damascene
processing.
The 1st metal layer is all tungsten and probably
forms the barrier to Cu - which is a deep level
in Si (will trap carriers like electrons and
degrade transistor performance)
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