Trikon Introduces Planar fxP: The First Cluster Tool Offering A Complete, Low k Dielectric Roadmap to 0.1 um Production
NEWPORT, Wales, U.K.--(BUSINESS WIRE)--April 5, 2000--
New, Versatile, Cost-Effective, & Production-Ready, Planar fxP
Delivers A Full Range of CVD Applications Using Trikon's
Flowfill(R) And Low k Flowfill(TM) Technologies
Trikon Technologies Inc. (Nasdaq OTC-BB: TRKN), the technology
leader in semiconductor processing equipment, today announced
availability of its new cluster tool for chemical vapor deposition
(CVD), the Planar fxP(TM), which offers a complete dielectric roadmap
to 0.1um production on a single product platform. A powerful
single-wafer cluster tool, it combines flexibility, productivity and
advanced technology to give semiconductor manufacturers a strong
competitive advantage enabling them to protect their initial capital
investment while they keep pace with evolving market conditions.
The Planar fxP uses Trikon's unique and patented Flowfill(R)
and Low k Flowfill(TM) technologies for standard and low k IMD
dielectrics, enabling logic and DRAM manufacturers to migrate
effortlessly to more advanced design rules and higher speed devices
without changing hardware.
Low k & Standard Flowfill
Low k Flowfill currently facilitates a subtractive aluminum,
'low k first' strategy for 0.18 um at k = 2.8. This exceeds ITRS
roadmap requirements, giving manufacturers like LSI Logic Corp.
(NYSE:LSI) the capability to produce speed-competitive products.
Since Low k Flowfill offers gap-filled to < 0.1 um, DRAM
manufacturers can adopt the same low k solution for their next 3 - 4
design nodes before switching to damascene technology. When they
do move to damascene, Low k Flowfill will provide a resilient,
ultra-low k film ( k < 2.5) which is ready to integrate with their
other processing steps.
Trikon's standard k Flowfill offers unsurpassed gap-fill and
self-planarization, making it an ideal choice for oxide IMD. Now, it
also provides an alternative, non-plasma based, advanced pre-metal
dielectric (PMD or ILD) solution for DRAM at 0.13um, and below, with a
low thermal budget.
"With today's device requirements driving design rules to smaller
critical dimensions, semiconductor manufactures are demanding
solutions that keep them on the cutting edge of technology whilst
holding the line on cost-of-ownership (CoO)" said Bernard Culverhouse,
Trikon's Vice President of Marketing. "The Planar fxP's Versatility
and flexibility make it the lowest cost, lowest risk production choice
available, today, enabling chipmakers to adapt their fabs and
operations so they can remain a step ahead of ever-changing market
conditions, " he added.
Planar fxP takes Trikon's production-proven CVD process hardware
and adds extra functionality and productivity with a new wafer
transport module that delivers higher throughput density. This
industry-proven, wafer transport module uses a fast action, robot
handler, with dual end effectors, that offers three axes of movement.
Two vacuum cassette loadlocks provide the interface to the fab and can
easily be integrated with SMIF or other automation systems. Control of
the tool is achieved through the Windows NT based graphical user
interface (GUI).
A wafer orient station and cool-down module, integrated within
the transport module, offer complete and comprehensive process control
and compatibility with standard plastic cassettes. Six process module
positions are available around the transfer module so that tool
configuration can be specified to maximize throughput.
"Because our low k solutions are fully integratable and
production-proven, our customers can maximize the built-in
productivity of the Planar fxP while realizing capital efficiency and
ROI much sooner after its installation," noted Andy Noakes, Trikon's
CVD Product Marketing Manager.
"In all, manufactures will greatly benefit from the increased
throughput and efficiencies realized from Planar fxP dielectric
processing," Mr. Noakes said. "Wafers leave the tool finished and
ready to move onto the next major process step, substantially reducing
work in-progress (WIP) and providing a smoother workflow throughout
the fab. And since Trikon's low k films are easy to integrate, there
is minimal impact on post-processing steps and equipment. This further
reduces the cost implementation and improves the time-to-market for a
manufacturer's products."
Trikon has also minimized the environmental impact of this new
tool by implementing a new plasma clean technology that minimizes PFC
emissions by over 85% and maximizes uptime and processed wafer
throughput between chamber cleanings.
Trikon's Flowfill and Low k Flowfill have also shown themselves to
be highly reliable, with production programs running at greater than
85% uptime; 90% in many cases. Planar fxPs have already been ordered
by LSI Logic Corporation (NYSE: LSI), Gresham, OR, and Silterra
Malaysia Sdn. Bhd. for their ongoing production programs, reaffirming
the reliability and quality of Trikon's enabling technologies.
Other recent Trikon announcement include:
- Triquint Semiconductor, Inc. orders additional Sigma PVD and MORI
plasma etch cluster tools for their wireless device production.
- Leading North American communications company orders 8 plasma etch
and PECVD systems for optoelectronic device manufacture on InP
wafers.
- Tower semiconductor Ltd. orders additional Flowfill(R) and
Forcefill(R) systems.
- 1999 financial results. Product sales up 92% on 1998
- First Asian foundry order for Low K Flowfill(TM)
- The first production orders for Low K Flowfill(TM) from LSI Logic
Corporation.
- LSI reports that using Low K Flowfill(TM) in their device designs
made possible "an immediate performance gain of nearly 25% over
similar designs using standard dielectric materials, but at no
significant extra cost."
- The first shipment of Trikon's new PVD cluster tool, the Sigma(R)
fxP(TM), to Infineon Technologies.
About Trikon Technologies Inc.
Trikon, www.trikon.com, has patents and patents pending on
Flowfill(R), Low K Flowfill(TM) as well as related processes and
continues to develop low-k chemistries and processes for advanced
applications. Trikon provides a broad line of advanced manufacturing
systems used for three of the major processing steps in the
manufacture of a semiconductor device: chemical vapor deposition
(CVD), physical vapor deposition (PVD) and plasma etch. Products
include: Low K Flowfill(TM) for advanced low-k insulator deposition,
Sigma(R) fxP for advanced metal deposition including barrier layers
and M0RI(TM) high-density plasma etchers.
"Safe Harbor" Statement Under the Private Securities Litigation
Act of 1995: This news release contains certain forward-looking
statements, including, but not limited to, statements relating to the
continued strength in demand for semiconductor production equipment
and the status of Trikon's products and their acceptance in the
marketplace. These forward-looking statements are subject to various
risks and uncertainties that could cause results to differ materially,
including, but not limited to, (1) that the semiconductor industry
will experience conditions, such as changes in demand for various
types of semiconductors, that will affect the demand for semiconductor
production equipment and Trikon's products, (2) that Trikon will not
adequately respond to technological developments impacting the
semiconductor industry, (3) market acceptance of Trikon's products
will not be forthcoming. These factors are not intended to represent a
complete list of all risks and uncertainties inherent in the Company's
business, and should be read in conjunction with the more detailed
cautionary statements included in the company's SEC reports,
including, without limitation, its annual report on Form 10-K,
quarterly reports on Form 10-Q and current reports on Form 8-k.
--30--mj/ny eb jh
CONTACT: Trikon Company Contact:
Andy Noakes, 44 (0) 1633 414013 (UK)
andy.noakes@trikon.com
or
Contact:
Lon Margulies, 212/725-4500
Imargulies@schwartz.com |
