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Politics : Formerly About Advanced Micro Devices

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To: Charles R who wrote (89078)	1/23/2000 2:09:00 AM
From: Process Boy	of 1575725

Charles- <Are you referring to the supposed aggressive metal pitches that AMD uses or something else?> No, that's it. Like I said, it's just a WAG. BTW, as I just posted to milo, check out this current article specifically outlining process issues going forward with .13um. Note this comment about Cu: semiconductor.net Copper interconnects Though copper interconnects originally offered the promise of 30% faster devices with fewer metal levels and lower-cost production, few companies have attained such dramatic performance and economic advantages with copper. Surprisingly, for some companies "copper is actually more of a cost driver than a performance driver, making low-k the key enabler for high performance," says FSI's Rode.... [Continues with a bunch of interesting stuff about Cu polish pad methodologies ;-).] PB

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