TRIKON WINS MULTIPLE ORDERS FROM NEW GaAs WIRELESS CHIP FAB IN ASIA - PVD, PECVD and Plasma Etch systems ordered
NEWPORT, Wales, United Kingdom--(BUSINESS WIRE)--April 18,
2000--Trikon Technologies, Inc. (OTC-BB: TRKN) a technology leader in
semiconductor processing equipment, today announced it had received an
order from a new gallium arsenide (GaAs) facility in Asia set to
manufacture wireless devices.
The order comprises a Sigma(R) PVD system for front and back-side
metalization, a Delta(R) for PECVD silicon nitride passivation and
Omega(R) ICP etch systems for both front-side thin film and
through-wafer plasma etching.
"Trikon's systems are ideally suited to compound semiconductor
processing," said Nick Carrington, Trikon senior vice president of
sales. "Trikon offers the advantage of a `one-stop shop' for many
customer's critical plasma process requirements; integrated processes
that add value for our customers. Our systems offer outstanding
process flexibility, excellent factory backup and are compact and
reliable. Trikon is an industry veteran bringing many years of
experience to the rapidly expanding markets for wireless and
optoelectronics device manufacture."
Mr. Carrington continued, "Compound semiconductor device makers
demand production equipment with the same quality of automation,
reliability and back-up that the leading silicon device makers
require. Trikon's ability to win business for plasma etch, CVD and PVD
equipment for mainstream silicon processing demonstrates the quality
of Trikon's products and operations, differentiating Trikon from many
of its competitors in the compound semiconductor equipment market."
Trikon's new technology products include:
Planar fxP(tm) Low K Flowfill(tm). An advanced low-k dielectric
deposition system capable of both gap fill and planarization enabling
the low-k advantage of increased device speed to be brought to
existing aluminum metalization devices as well as copper.
Sigma(R) fxP(tm) PVD. A metalization system offering high
throughput and reliability with advanced process modules for high
uniformity PVD, metal plug (Forcefill(R)) and advanced barrier
deposition processes including ionized PVD.
Omega(R) M0RI(tm). An advanced high density plasma etch chamber on
a small footprint platform. The Omega(R) etcher can be configured with
two chambers offering plasma etching and dedicated post etch
processing or dual chambers for higher throughput.
Trikon have recently made announcements including:
-- LSI Logic orders a Planar fxP(tm) Low K Flowfill(tm) and a
M0RI(tm) Omega(R) plasma etcher for Gflx(tm) (0.13-micron drawn)
process technology. Reports 36% speed improvement of G12(tm) (0.18
micron drawn) using Flowfill(tm)
-- Repeat orders from TriQuint for PVD and plasma etch equipment
for wireless device manufacture
-- Leading North American communications company orders 8 plasma
etch and PECVD systems for optoelectronics device manufacture on InP
wafers
-- Exchange of bonds and preferred notes for common stock reducing
dividend payable in fiscal 2000 by $1.1m and reducing interest payable
by $72,000
-- Tower Semiconductor Ltd. order additional Flowfill(R)and
Forcefill(R)systems for production expansion
-- 1999 financial results. Product sales up 92% on 1998
About Trikon Technologies
Trikon, www.trikon.com offers a broad range of semiconductor
processing equipment for silicon and compound device production.
Trikon has patents and patents pending on processes and equipment
including Flowfill(R) and Low K Flowfill(tm) and continues to develop
low-k chemistries and processes for advanced applications. Trikon's
systems are used for three of the major processing steps in the
manufacture of a semiconductor device: plasma etching and dielectric
and metal vapor deposition. Products include: Low K Flowfill(tm) for
advanced low-k insulator deposition, Sigma(R) fxP for advanced metal
deposition including barrier layers and M0RI(tm) high-density plasma
etchers.
"Safe Harbor" Statement Under the Private Securities Litigation
Act of 1995: This news release contains certain forward-looking
statements, including, but not limited to, statements relating to the
continued strength in demand for semiconductor production equipment
and the status of Trikon's products and their acceptance in the
marketplace. These forward-looking statements are subject to various
risks and uncertainties that could cause results to differ materially,
including, but not limited to, (1) that the semiconductor industry
will experience conditions, such as changes in demand for various
types of semiconductors, that will affect the demand for semiconductor
production equipment and Trikon's products, (2) that Trikon will not
adequately respond to technological developments impacting the
semiconductor industry, (3) market acceptance of Trikon's products
will not be forthcoming. These factors are not intended to represent a
complete list of all risks and uncertainties inherent in the Company's
business, and should be read in conjunction with the more detailed
cautionary statements included in the company's SEC reports,
including, without limitation, its annual report on Form 10-K,
quarterly reports on Form 10-Q and current reports on Form 8-K.
CONTACT:
Trikon: Trikon IR:
Carl Brancher Alexander Fudukidis
Trikon Technologies Ludgate Communications
44 (0) 1633 414111 (U.K.) (212) 515-0246
carl.brancher@trikon.com fudukidi@ludgateny.com |
