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Politics : Formerly About Applied Materials
AMAT 304.08+2.2%Feb 5 3:59 PM EST
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To: Proud_Infidel who wrote (9177)10/22/1997 12:16:00 PM
From: Eric Sandeen   of 70976
 
The 2.25x figure comes straight from geometry for the area of the wafers. (Area = Pi * R^2) If you need help. :-)

So, comparing 200 and 300 mm dia wafers,

Pi*(150^2)
------------ = 2.25x the area
Pi*(100^2)

However, achieving uniform processes (deposition, etch, etc.) across the larger area is one of the technical challenges for 300mm design. It seems reasonable that it's harder to maintain the process out towards the edge of the larger wafer.

So, I think that there is probably some truth to the statement that output may not be increased by 2.25 immediately. This is just a hunch of mine - I haven't designed any chambers lately. :-)

But hey, even 2x output for 40% cost increase (if that's correct) doesn't sound too bad.

-Eric
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