[ I300I Participants ] Pat, One of my holdings was selected to be a fab supplier to this consortium.
I have a feeling that a lot of these new chips will be integrated into the internet bandwidth boom.
Check out the companies and the last statement.
[snip]
According to Frank Robertson, vice president and general manager of the International 300 mm Initiative, the thirteen consortium participants are cooperating to define guidelines that will ease the transition to 300 mm wafer processing, and ensure the capability to implement 300 mm at the right time for the industry. The participants include AMD, Hyundai, IBM, Intel, LG Semicon, Lucent Technologies, Motorola, Phillips, Samsung, Siemens, SGS-Thompson, Texas Instruments and TSMC. With regard to wafer delivery and loading, "I300I member companies have
****asked all tool suppliers to integrate lot buffers to ensure non-stop operation of fab equipment," said Robertson. |
