Novellus Introduces Integrated Low-k Solution for Next-Generation Copper Chips
CORAL Family of Films Available in 300 mm Version by End of Year
SAN JOSE, Calif.--(BUSINESS WIRE)--June 11, 1999--Novellus Systems Inc. (Nasdaq:NVLS - news), the productivity and innovation leader in thin film deposition technologies for the global semiconductor industry, today unveiled its new CORAL(TM) family of production-worthy low dielectric constant (low-k) films for advanced devices.
Designed for deposition on Novellus' enhanced SEQUEL Express(TM) platform -- also introduced today -- the CORAL family of films completes the company's offerings of dielectric films required to build copper dual damascene structures extendable down to sub-0.1-micron technologies. A 300 mm version of the CORAL system will be available for shipment later this year, running on the same production-proven platform.
Low-k dielectrics and copper interconnects are two key elements necessary to build the advanced integrated circuits (ICs) required for today's increasingly powerful consumer electronics. These applications require faster and smaller ICs that have increased functionality, yet consume less power.
To build these chips it is necessary to lower both the effective interconnect resistivity and capacitance. Copper addresses the low-resistivity side of the equation. The proper combination of low-k via and line dielectrics and thin films for copper barriers and etch stops solves the low-capacitance side.
''A year ago we enabled the development of copper interconnects for the semiconductor industry with the introduction of SABRE(TM), the first production-worthy copper electrofill tool, and our INOVA(TM) tool, which provides a superior deposition solution for the required barrier and seed layers. Today, with the introduction of our CORAL-based, low-k dielectric solution, which is completely optimized for copper-based devices, Novellus has extended the 'Road to Damascus' further into the future,'' said Novellus Chairman and Chief Executive Officer Richard S. Hill. ''The combination of these low-k and via and line dielectrics and thin film barrier technologies will enable the manufacture of advanced devices down to the sub-0.1-micron node, enabling the development and production of powerful electronic systems designed to meet consumer demands.''
Semiconductor manufacturers require production-worthy low-k dielectric films that are extendible and have a low cost of ownership (CoO). Novellus has leveraged its historical expertise in blanket dielectrics and developed the CORAL family of carbon doped oxide films, with dielectric constants ranging from 3.3 to less than 2.5.
The films are easily integrated into the dual damascene process flow with their dielectric etch, metal deposition and chemical mechanical polishing (CMP) processes, developed in collaboration with Novellus' Damascus Alliance partners, at a cost comparable to traditional dielectric films and other competitive offerings.
Recognizing that barrier layers are critical to developing a truly low-k integrated stack, Novellus has developed a variety of dielectric barriers and etch stops for low-k films. ''By optimizing CORAL with the right thin films, we are able to deliver the full benefits of dielectric constant reduction,'' said Novellus Vice President for Dielectrics Wilbert van den Hoek. ''For instance, a CORAL film with a dielectric constant of 2.7, optimized with an oxide-based barrier with a dielectric constant of 4.1, yields an effective capacitance reduction of up to 40 percent.''
According to Novellus' research, the market for damascene dielectric films is expected to grow to more than $500 million by 2003. With the introduction of the CORAL family of films, Novellus continues to extend its tradition of offering the lowest risk, highest performance and lowest cost thin film deposition solutions for the most advanced semiconductor process technologies.
Designed for CORAL and Novellus' other dual damascene barrier films, the SEQUEL Express deposition system leverages the production-proven multi-station sequential deposition architecture to deliver superior reproducibility. The SEQUEL Express system has a maximum throughput in excess of 110 wafers per hour (wph) for thin films and in excess of 80 wph for CORAL films.
It delivers up to 40 percent higher capital productivity, up to 100 percent higher productivity per square foot of footprint and up to 40 percent lower CoO than competing CVD systems.
Novellus will begin volume shipments of its CORAL low-k dielectric process on SEQUEL Express later this year and has received orders from several customers for CORAL film upgrade kits. The company has already shipped approximately 20 SEQUEL Express systems for the deposition of other dielectric films required for dual damascene to customers worldwide.
Novellus will feature the CORAL family of films and SEQUEL Express, along with its Damascus® Complete Copper(TM) line of products and services at the Yerba Buena Center, adjacent to the Moscone Center, San Francisco, during SEMICON West '99, to be held July 12-14.
About Novellus Systems
Novellus Systems Inc. manufactures, markets and services advanced automated wafer fabrication systems for the deposition of thin films. Novellus deposition systems are designed for high-volume production of advanced, leading-edge semiconductors at the lowest overall cost.
Headquartered in San Jose, with subsidiaries in the United Kingdom, France, Germany, the Netherlands, China, Japan, Korea, Singapore and Taiwan, Novellus is a publicly traded company on the Nasdaq stock exchange (Nasdaq:NVLS - news). Additional information about the company is available on Novellus' home page on the World Wide Web, located at novellus.com.
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Contact:
Novellus Systems Inc.
Bob Climo, 408/943-9700
bob.climo@novellus.com
or
MCA Inc.
Chris Castillo, 650/968-8900
castillo@mcapr.com
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