SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Rambus (RMBS) - Eagle or Penguin
RMBS 95.53+0.7%Nov 28 12:59 PM EST

 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext  
To: Tom Warren who wrote (23323)6/22/1999 3:32:00 PM
From: Zeev Hed  Read Replies (1) of 93625
 
Tom, only one comment, wafer scale integration will require solving some non trivial heat removal problems. Trilogy went down the drain on that one with 4" wafers, I would guess that 8" wafers (not talking about the next generation 12" wafers) would present problems that are far greater, particularly when design rules in the sub .25 microns and switching speeds approaching the GHz range are concerned (heat generation increases rapidly with switching speeds at each junction). I am working on some aspects of dynamic cooling of chips and that problem is far from trivial, particularly if one sticks to Olsen's philosophy "no plumbing in my computers". <g>

Zeev
Report TOU ViolationShare This Post
 Public ReplyPrvt ReplyMark as Last ReadFilePrevious 10Next 10PreviousNext