OTOTOT Don't mean to disrupt the golf talk but here is a little Rambus info, not much, but a little:
BW0150 JUN 30,1999 8:00 PACIFIC 11:00 EASTERN
( BW)(CA-RAYCHEM)(RYC) Raychem Gel Based Products Provide Total
Thermal Solution for Rambus RIMM Modules;
Business Editors/High-tech Writers
MENLO PARK, Calif.--(BUSINESS WIRE)--June 30, 1999--
Gel Material Offers High Thermal Conductivity, Softness and High
Surface Tack; Heat Spreader Plate Meets Intel Requirements
Raychem Corporation now offers a total thermal solution which includes interface material and a
heat spreader plate for Rambus RIMM modules. After extensive thermal and mechanical modeling
and testing Raychem is now offering the HeatPath GTQ-HS2-R100 heat spreader and HeatPath
GTQ R100 interface material that cost-effectively maximizes heat transfer for Rambus RIMM
modules.
HeatPath interface material has been shown to provide exceptionally low thermal resistance and
minimal mechanical stress on components due to its inherent surface wetting and softness. The
HeatPath heat spreader plate meets Intel's requirements for 1.25-inch RIMM modules. The plates are
available in a range of colors and with custom logos.
"We have combined our popular HeatPath gel interface material and the Rambus/Intel heat
spreader reference design together with high-quality assembly to provide a high-performance package
which simplifies module makers' production and logistics," reports Greg Bischak, director of
marketing. Furthermore, he points out, "The HeatPath GTQ-R100 gel interface material offers
optimum thermal performance through its unique surface wetting and exceptional softness. At the
same time minimal stress is imparted to chipset packages and manufacturing height tolerances can be
accommodated. We believe we offer the best performing most cost-effective solution worldwide".
The thermal interface material is soft and highly compressible accommodating a range of gaps,
tolerances and uneven surfaces. Thermal conductivity is 1.1 W/m(degrees)K.
The HeatPath interface material consists of an alumina-filled silicone gel that provides excellent heat
transfer capability. It incorporates a fiber glass carrier which improves handling and tear resistance.
Inherently very tacky, it stays in position during assembly without the need for adhesives and can be
easily removed.
Laboratory measurements on simulated RIMM modules show lower device operating temperature
when compared to materials with equal or even greater thermal conductivity.
The HeatPath interface material is offered in a range of thickness from 0.25 mm to 1.0 mm.
Customers can also purchase the interface material separately in easy-to-handle precut standard sizes
delivered in bulk rolls on Mylar backing. The material can be attached to heat spreaders manually or
with pick-and-place equipment.
Pricing and availability
Samples are available from stock. Standard delivery for production quantities is two to four weeks
ARO. Price for the total solution is $0.65 per set for quantities of 50,000 pieces. A set consists of a
heat spreader plate and the accompanying interface material. Standard packaging for the spreader
plate is in covered plastic trays of 50 pieces. Prices for the interface material are in the $0.11 per
square inch range depending on volume.
For more information about Raychem's thermal management products, please visit
www.raychem.com/go/thermal, call (800) 926-2425, or write to Raychem Corporation, Electronics
OEM Components Division, 300 Constitution Drive, MS 110/2A, Menlo Park, CA 94025.
HeatPath is a trademark of Raychem Corporation. Rambus and RIMM are trademarks of
Rambus, Inc. All other products and companies referred to herein are trademarks or registered
trademarks of their respective companies or mark holders.
Raychem Corporation
Raychem Corporation of Menlo Park, California, is an international company with approximately
9,000 employees in 49 countries and revenues of $1.8 billion in fiscal 1998. The company utilizes
expertise in materials science, electronics, and process engineering to develop, manufacture, and
market high-performance products for electronics OEM businesses, telecommunications and energy
networks, and the commercial and industrial infrastructure. On May 19, 1999, Raychem announced
its agreement to merge with Tyco International Ltd., a diversified manufacturing and service company.
More information on Raychem is available at www.raychem.com.
--30--slt/sf*
CONTACT: Raychem Corporation
Maria Stec, 650/361-4513
mstec.raychem.com
or
Brodeur Porter Novelli
Jill Dornan, 408/324-4848
jdornan@brodeur.com
KEYWORD: CALIFORNIA
INDUSTRY KEYWORD: COMPUTERS/ELECTRONICS COMED PRODUCT |
