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To: Chuca Marsh who wrote (1163)7/5/1999 11:37:00 AM
From: Chuca Marsh  Read Replies (1) of 1364
 
The Patent on The New CHIP:
patents.ibm.com
Inventor(s):
Popovici; Galina , Columbia, MO
Prelas; Mark A. , Columbia, MO
Sung; T. , Columbia, MO
Khasawinah; S. , Columbia, MO


Priority Number(s):
US1994000313641

Abstract: A method of making a semiconductor material using a modified
forced diffusion method includes the steps of placing the
semiconductor material on a substrate in a vacuum vessel, locating an impurity atop the semiconductor material, creating a high voltage potential across the semiconductor material, heating the semiconductor material and bombarding the semiconductor material with photons under the effects of the high voltage and heat previously created. The process is particularly applicable to creating N-type diamond semiconductor material.
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