Amkor Supports Stacked Chip-Scale (CS)packages
A service of Semiconductor Business News, CMP Media Inc.
Story posted 8 a.m. EST/5 a.m., PST, 7/6/99
TOKYO--Four major semiconductor companies announed thay have agreed to standardize specifications for stacked chip-scale packages (S-CSP), a multiple memory module for mobile communications and hand-held computing applications.
Sharp Corp. and Mitsubishi Electric Corp. first proposed the S-CSP specifications last September. Joining them in the standardization effort are Hitachi Ltd. and Intel Corp. In addition, five other packaging and assembly companies -- Seiko Epson, Sanyo Electric, Mitsui High-tec, Amkor Technology, and Power Technology -- have announced they will support the unified S-CSP specifications.
The specification standard of S-CSP with Flash memory and SRAM chips stacked in one package includes compatibility of pin assign; unification of ball layout and ball pitch, calling for 64-pin, 72-pin, and 0.8-mm ball pitch; and unification of package size, which calls for 8x8-, 8x10-, 8x11-, and 8x12-mm, with a maximum height of 1.40-mm.
It is hoped that expanding the unified specifications group will help meet the demand for S-CSP products, which have been in volume production since April 1998. Adding two new members, Hitachi and Intel, will help speed its adoption as a de facto standard for the world semiconductor industry, they said.
In addition, the group will contribute to the diversification of S-CSP devices and will also support users by creating smaller, lighter and highly reliable advanced products in applications markets including mobile phones and hand-held computers.
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