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Technology Stocks : Speedfam [SFAM] Lovers Unite !

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To: Sultan who wrote (3437)7/6/1999 8:10:00 PM
From: Proud_Infidel  Read Replies (1) of 3736
 
Tuesday July 6, 5:00 pm Eastern Time
Company Press Release
SOURCE: Rodel, Inc.; SpeedFam-IPEC, Inc.
Rodel and SpeedFam-IPEC to Develop Next Generation Processes for CMP; Plan Includes Both Orbital CMP and Web CMP Using 3M Fixed Abrasive Matrix
PHOENIX, July 6 /PRNewswire/ -- Rodel, Inc. and SpeedFam-IPEC (Nasdaq: SFAM - news) have announced that they have signed a joint development agreement to develop processes for leading edge CMP applications using slurry- free CMP products from Minnesota Mining and Manufacturing (3M) of St. Paul, Minnesota. Rodel is the global market channel and development partner for the 3M technology. Initial work will focus on copper processes on IPEC's 676 and 776 platforms as well as shallow trench isolation processes on a new web platform recently announced by SpeedFam-IPEC.

''We are very encouraged by the recent publications showing the feasibility of copper CMP processes with the 3M matrix product on the SpeedFam-IPEC AvantGaard tool,'' stated Scott Loncki, Vice President and General Manager of Rodel's CMP business unit. ''In addition, 3M has already demonstrated a production-worthy product in the web format for shallow trench isolation which will be launched commercially in the next few weeks. This product will enable us to support the new tool development with a proven consumable product and a Rodel Process(TM) with SpeedFam-IPEC.''

Greg Shepard, Senior Vice President, Marketing and Strategic Business Development for SpeedFam-IPEC stated, ''Working with Rodel and 3M's fixed abrasive matrix will increase the speed to market of integrated solutions for next generation CMP applications. The addition of the new web format positions SpeedFam-IPEC as the only company to offer three distinct lines of CMP equipment -- rotational, orbital and web.''

Rodel, Inc.

Rodel, the global leader in polishing technology for semiconductors, silicon wafers, and storage media substrates, has been a key supplier to the semiconductor industry for 30 years. The company has operations throughout the United States, Asia and Europe. Rodel is a privately-held concern with a 48% interest held by Rohm and Haas, which has over $1 billion in sales of electronic materials.

SpeedFam-IPEC, Inc.

SpeedFam-IPEC, Inc. designs, develops, manufactures, markets and supports chemical mechanical planarization (CMP) systems used in the fabrication of semiconductor devices and other high-throughput precision surface processing systems. SpeedFam-IPEC's flat surface processing systems are used in the thin film memory disk media, silicon wafer, and general industrial components markets. In addition, the company manufactures and supports advanced plasma- assisted etching and metrology equipment used in the manufacture of silicon wafers.

SOURCE: Rodel, Inc.; SpeedFam-IPEC, Inc.

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