SpeedFam-IPEC AvantGaard 876 300mm CMP System Successfully Completes I300I Requirements for Phase 3 Testing
CHANDLER, Ariz.--(BUSINESS WIRE)--July 8, 1999--SpeedFam-IPEC (Nasdaq:SFAM - news), a leading supplier of chemical mechanical planarization (CMP) systems used in the fabrication of semiconductor devices, today announced it has successfully completed all scheduled I300I Phase 3 testing requirements of the AvantGaard(TM) 876 Chemical Mechanical Planarization (CMP) Wafer Processing Capsule for 300mm wafers.
I300I Phase 3 testing included a marathon oxide processing run which lasted 169.2 hours. During this run the AvantGaard(TM) 876 processed more than 5000 wafers and provided performance results of 91.2% operational time. The test included three pad changes, re-qualification time, and preventative maintenance for the week. ''We experienced only one simple failure during the run,'' said Joe Gisler, senior product manager for 300mm. Wafer non-uniformity was measured throughout the test with outstanding uniformity results averaging less than 2.2% NU 1(sigma). Average removal rates were greater than 4800A/min. In addition, Mechanical Dry Cycle (MDC) tests were also completed, during which the AvantGaard(TM) 876 cycled 7191 wafers with a mean wafer between interrupts (MWBI) of 1998 wafers.
''We are delighted by the I300I test results,'' said Gisler, ''because it validates the attention to reliability and performance that is designed into the AvantGaard(TM) 876. The system has been designed to specifically address the upcoming 0.13u technology at all levels; oxide, tungsten, STI, and the burgeoning copper processing requirements specific to this technology.''
SpeedFam-IPEC has been developing the 300mm CMP platform for more than two years,'' said Karen Sutter, 300mm program manager for SpeedFam-IPEC. The AvantGaard(TM) 876 is a fully integrated system with all electrical components on-board, says Sutter. It combines a modular, multi-polish head, orbital technology with an advanced cleaning system into an open architecture design, which can also support the integration of other industry standard cleaners. Key to the system performance is a new optical endpointing subsystem utilizable for oxide, shallow trench isolation (STI), tungsten or copper processing. The 876 is fully compliant to SEMI automated factory capability, with three front opening unified pods (FOUPs) and a class M1 mini-environment subsystem. The 876 presents a compact footprint of 94.5 square feet, and the 3mm edge exclusion required for achieving maximum productivity.
Multiple systems are in operation in SpeedFam-IPEC labs where they are utilized for process development work as well as for performing customer demonstrations. ''The AvantGaard 876 made its debut at Semicon West '98 where it performed virtually flawlessly during the show,'' added Sutter. ''Even though there was an industry wide de-emphasis on 300mm requirements following last year's show, we believe our continued development efforts have placed the AvantGaard 876 in a premier position as the market turns its attention again to 300mm technology.''
SpeedFam-IPEC, Inc.
SpeedFam-IPEC, Inc. designs, develops, manufactures, markets and supports chemical mechanical planarization (CMP) systems used in the fabrication of semiconductor devices and other high-throughput precision surface processing systems.
SpeedFam-IPEC's flat surface processing systems are used in the thin film memory disk media, silicon wafer and general industrial components markets.
The company also markets and distributes polishing liquids (slurries), parts and consumables used in its customers' manufacturing processes. SpeedFam-IPEC, Inc. owns a 50-percent interest in each of two joint ventures, SpeedFam-IPEC Co., Ltd. (the Far East Joint Venture) and Fujimi Corp.
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Contact:
SpeedFam-IPEC
Dr. Joe Gisler, 480/961-1600
Product Marketing Manager
Carrie R. Foote, 480/961-1600
Marketing Communications Manager
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