More Quotes from Brad M on his philosophy of improving the productivity of the fab tools in another July Print edition article from SemiBizNews...
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supersite.net
Another trend that's driving up the price of individual tools, but which is also adding higher levels of control and flexibility is the move from batch to single-wafer processing, say many equipment suppliers. Some single-wafer tools, such as rapid-thermal processing (RTP) systems, are not only working on one substrate at a time but they alsoare beginning to do it so fast that they're rivaling batch systems in total throughput.
"One major issue for fabs is reducing the time it takes to get products through the factory," explains Brad Mattson, CEO of Mattson Technology Inc. in Fremont, Calif. "One way to do that is with raw speed and the other is with cycle time. Single-wafer processing greatly improves the cycle time in fabs when you no longer have to accumulate hundreds of wafers for batch furnaces or wet benches."
Single-wafer processing architectures have helped some equipment makers create new "bridge tool" platforms capable of handling today' 200-mm wafers but also able to process 300-mm substrates when they move into production. This strategy is aimed at sharing costs between new 200-mm processes and the initial 300-mm tool set while equipment suppliers wait for chip makers to make the transition to larger wafer diameters.
"The cost of 300-mm wafers will be monumental and that will drive you to single-wafer processing through out the fab," predicts Richard A. Aurelio, CEO of Varian Semiconductor Equipment Associates Inc. in Gloucester, Mass., which moved to a single-wafer platform for its ion implanters six years ago. "Single-wafer processing will allow you to work with smaller batch sizes [of IC designs], which will be essential for silicon foundry operations," he maintains
P.S. Does anyone know of another supplier other than MTSN that has a 200mm / 300mm bridge tool? |
