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Politics : Formerly About Advanced Micro Devices
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To: Steve Porter who wrote (65057)7/13/1999 12:06:00 PM
From: Saturn V   of 1582864
 
Ref - Moving K-62 to plastic wire bond package

I do not think it makes sense for AMD to use up precious design resources to relayout the K-62 for wire bonded packaging. The Vcc and Vss wire bond inductance problem is severe. Beyond 400-500 Mhz, you almost run into a wall. Several hundred output buffers switch simultaneously, and the corresponding 'spike currents' reduces the voltage dramatically (due to the parasitic inductance), degrading speed. The chip designers are working very hard to combat this problem.

If the objective is to cut cost, it will be a safer bet for AMD to copy Intel's OLGA package, which performs flip chip bonding on an organic substrate. It will probably save $10-$15 in package cost,and will not suck up design resources.
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