Scott,
Analyst targets are generally for the next 12 months. The range tends to be from 6 months to 18 months.
Some corrections to the measures in your post:
One thing that's struck me in listening to the conference calls (yes, I'm working on a transcript. This CC was a long one, so it's gonna take a while), is that Cymer has products for 248, 193, 157, and 13.5 micron [should be nanometers] wavelengths. That seems like a big gap between the 157 and 13.5 wavelengths. Is the industry really going to make a jump like that (I realize that the 157 nm [already correct] will probably be usable to etch feature sizes somewhat smaller than 157 microns [157 microns could be done with a fine chisel. <g>; again, you meant 157nm]), or should we expect the development of some wavelength in between?
With DUV, tricks are used to allow features smaller than the wavelength of the light to be patterned on the wafer. With CYMI's EUV, which they also refer to as "soft X-rays", it's unlikely that those or similar optical manipulations will be made to work. Thus the minimum feature size might eventually get to be 13.5nm, but is more likely to be a multiple of it.
The EUV Consortium might come up with a completely different EUV source at a different wavelength in the spectrum.
But right now, CYMI can generate a controlled EUV light source. No one else can. Yet!
Ian.
P.S. Again thanks for all the transcripts. |
