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Technology Stocks : Rambus (RMBS) - Eagle or Penguin
RMBS 88.13+1.1%3:59 PM EST

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To: Jdaasoc who wrote (25862)7/28/1999 4:32:00 PM
From: Zeev Hed  Read Replies (2) of 93625
 
JD, good thermal conductivity does not solve the problem of getting rid of the heat generated, only get that heats to the outer surface a little better (thus a smaller thermal gradient on the chip), you still need to find a way to remove that heat from that surface. If air blowing is not enough, then you are left with little alternatives as Trilogy has found out in their futile attempt to do wafer scale integration.

Furthermore, I have still to see the premium of Si-28 over Si, if it reaches the prices of GaAs wafers, then why do it on an Si-28? Use GaAs as your wafer, the switching speed times heat generation per switch is at least 10 times better than Si, thus the 50% improvement in thermal conductivity is immaterial.

Zeev
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