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Technology Stocks : Stock Swap

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To: Dale Knipschield who wrote (16621)8/3/1999 4:53:00 AM
From: Andrew Vance   of 17305
 
*AV* -- there is some concern but we are fully aware of this. There is some competition between FOUPs and PODs but ASYT delivers more than just pods and in certain cases, front loading carriers are preferable. The article does indicate that the FOUPs number in the hundreds so it looks like this Motorola project could be 100% FOUPs. This does not mean that ASYT is left in the lurch since competition is good and ASYT could never supply the full indistry demand. ASYT makes the "robotic arms and enclosures for process equipment that will remove the wafer cassette from the PODs or FOUPs. Given the way the FOUPs open, the ASYT ARMS already can access the wafer cassetes or can be modified to handle them.

My big question is the adoption of integrated indexers and/or internal robitcs to transfer wafers to the process tool. Each tool is configured differently and each is treated on an individual basis. A FOUP is great when you are going into a batch wafer processor and a POD is superior if incorporated with an integrated indexer in a stepper.

Truthfully, the more I read, the more confused I get since I thought ASYT had a few FOUP type products on the books in addition to their tools. Besides, wafer carriers are only part of the equation. I see a place for both but I guess the industry is too ahort sighted to blend both together.

AV
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